Guide to Choosing Between Copper and Aluminum for ARM Applications When selecting materials for ARM (Advanced RISC Machine) applications, copper and aluminum are two common choices for conductive components, heat sinks, and interconnects. Each material has distinct advantages and trade-offs, making the decision dependent on specific requirements such as conductivity, weight, cost, and thermal performance. Electrical Conductivity Copper is the superior conductor, with an electrical conductivity of approximately 58 MS/m, compared to aluminum’s 37 MS/m. This makes copper ideal for high-frequency and high-power applications where minimal resistance is critical. However, aluminum’s lighter weight and lower cost often make it a practical alternative, especially in applications where slight conductivity losses are acceptable. Thermal Performance Copper also excels in thermal conductivity (385 W/m·K vs. aluminum’s 205 W/m·K), making it the preferred choice for heat sinks and thermal management in high-performance ARM processors. Aluminum, while less efficient, is widely used in consumer electronics due to its balance of thermal dissipation and cost-effectiveness. Weight and Cost Aluminum is significantly lighter (2.7 g/cm³ vs. copper’s 8.96 g/cm³), which is advantageous in portable and aerospace applications. Additionally, aluminum is cheaper and more abundant, reducing manufacturing costs. Copper, while more expensive, offers long-term durability and better performance in demanding environments. Corrosion and Oxidation Aluminum forms a protective oxide layer, preventing further corrosion, but this layer can increase contact resistance. Copper oxidizes over time, leading to tarnishing, but proper plating or coatings can mitigate this issue. Manufacturing and Fabrication Aluminum is easier to machine and extrude, making it suitable for complex heat sink designs. Copper is more challenging to work with due to its malleability but is preferred for high-precision interconnects. Conclusion The choice between copper and aluminum depends on the application’s priorities. Copper is best for high-performance, high-reliability ARM systems, while aluminum offers a cost-effective, lightweight solution for consumer and portable electronics. Engineers must weigh conductivity, thermal management, weight, and budget to select the optimal material.